Tag

advanced packaging

2 published articles

KLA’s Record Results Signal Strong Process-Control Demand

KLA’s fiscal 2026 performance provides a strong company-specific signal that rising chip-manufacturing complexity is increasing demand for inspection, metrology and process-control equipment.

Publish Nexus EditorialJuly 29, 2026

Hardware

Intel and Lens Technology Target Glass Substrates for the Next AI Chip Packages

Intel and Lens Technology have announced a strategic collaboration to explore glass-substrate packaging, aiming to address the mounting density, power and reliability demands of AI and data-centre systems.

Publish Nexus EditorialJuly 26, 2026