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8 published articles
Behind every app there is silicon, cooling and a supply chain. We map processors, chips, semiconductors and devices from phones to data centres. We track performance, energy use and the geopolitics of chip manufacturing. Technical analysis is translated into plain language, without marketing spin.
KLA’s fiscal 2026 performance provides a strong company-specific signal that rising chip-manufacturing complexity is increasing demand for inspection, metrology and process-control equipment.
Corning’s second-quarter performance shows that the AI infrastructure buildout is increasingly constrained not only by processors and power, but also by the optical hardware needed to connect very large computing clusters.
Axcelis Technologies has completed a customer evaluation of its Purion XEmax high-energy ion implanter for a power-management IC application, marking a qualified production use case rather than a disclosed equipment order or volume ramp.
Rambus’s second-quarter results show rising demand for the specialised memory-interface chips and high-speed interconnect IP that help data-centre systems move and manage data around AI workloads.
Lattice Semiconductor has completed its acquisition of AMI, bringing low-power programmable logic and silicon-neutral platform firmware together under one corporate structure for AI and data-centre infrastructure.
Intel’s second-quarter results show a sharp improvement in core operations, but they also underline how much its recovery depends on turning 18A production progress into durable product and foundry demand.
Microsoft plans to introduce AMD’s Helios rack-scale AI systems, next-generation EPYC CPUs and expanded Pensando networking across Azure, extending its multi-vendor approach to AI infrastructure.
Intel and Lens Technology have announced a strategic collaboration to explore glass-substrate packaging, aiming to address the mounting density, power and reliability demands of AI and data-centre systems.
