
HardwareSK hynix has approved about KRW 54.3 trillion in new fabrication investment at Yongin and Cheongju, turning its longer-term AI memory expansion strategy into two near-term construction programmes.

HardwareSK hynix is pursuing a 3D DRAM-on-logic architecture for future on-device AI, but this should not be confused with TSMC’s separately reported WMCM packaging approach.

HardwareSK hynix’s preliminary second-quarter figures and reported HBM4 mass shipments suggest that AI infrastructure is turning advanced memory supply into a strategic, contracted and capacity-constrained market.