Behind every app there is silicon, cooling and a supply chain. We map processors, chips, semiconductors and devices from phones to data centres. We track performance, energy use and the geopolitics of chip manufacturing. Technical analysis is translated into plain language, without marketing spin.
Tesla’s Terafab recruitment shows that Musk’s semiconductor project is moving beyond broad ambition towards the specialist process work required for advanced memory, although commercial production remains a distant and unusually difficult objective.
Sony Semiconductor Solutions and TSMC have signed a preliminary agreement to pursue a Japan-based joint venture for next-generation image sensors, extending a partnership that combines sensor design with advanced chip manufacturing.
A fresh leak suggests Intel may be preparing a Nova Lake-S desktop processor that treats integrated graphics as a major power and platform-design priority rather than a basic display feature.
AMD has added the Ryzen 7 449 and Ryzen 5 439 to its mobile Ryzen 400 lineup, retaining Zen 5-based CPU and RDNA 3.5 graphics resources while omitting the dedicated AI engine found in Ryzen AI equivalents.
A reported US$38 billion in customer collateral highlights how AI-led demand has shifted bargaining power towards the small group of companies that make advanced memory chips.
Lexar’s new 32GB DDR5-7200 retail kit is notable less for its headline speed than for the evidence that Chinese-made DRAM is moving into higher-performance consumer memory modules.
NVIDIA’s decision to sell limited Founders Edition cards at list price during QuakeCon turned ordinary retail access into a notable convention attraction.
Mesa’s addition of AMD GFX11.7 support is an important software-enablement milestone for an unannounced integrated GPU family, but it does not yet confirm the products, specifications or release schedule behind it.
DropReference’s US launch brings live component pricing, compatibility guidance and estimated game performance into a single PC-building service, but shoppers should still treat its results as decision support rather than a final verdict.
SK hynix has approved about KRW 54.3 trillion in new fabrication investment at Yongin and Cheongju, turning its longer-term AI memory expansion strategy into two near-term construction programmes.
Nanya Technology’s Fab 5A project has evolved from a NT$300 billion plan into a NT$480 billion capacity and technology programme aimed at strengthening its position in a constrained DRAM market.
A report that TSMC is holding about US$1 billion of Apple chips while awaiting DRAM deliveries underlines how a memory shortage can disrupt device production even after leading-edge processors have been fabricated.